发布日期：
摘要
Description
Will WLAN, NFC and UWB join Bluetooth in future handsets? Berg Insight forecasts that 25 percent of mobile handsets sold in 2012 will feature wireless local area network connectivity. NFC and UWB are also predicted to gradually enter the high-end market segment. Find out more about these future handset connectivity technologies in this 100+ page strategic research report from Berg Insight.
目录及图表
FUTURE HANDSET CONNECTIVITY TECHNOLOGIES INDEX
i
STRATEGIC RESEARCH SERIES VAS RESEARCH SERIES
Index
Table of Contents
Table of Contents......................................................................................................................... i
List of Figures.............................................................................................................................. v
Executive summary.....................................................................................................................1
1 Handset connectivity technologies......................................................................................3
1.1 Wireless communication technologies........................................................................4
1.1.1 Personal area and local area network technologies.............................................5
1.1.2 Cellular mobile communication technologies.......................................................6
1.1.3 Spectrum and interference....................................................................................6
1.1.4 Technical comparison...........................................................................................7
1.2 Broadcast connectivity technologies ..........................................................................8
1.2.1 Radio .....................................................................................................................8
1.2.2 Mobile TV...............................................................................................................8
1.2.3 GPS .......................................................................................................................9
1.3 Handset platforms and connectivity integration........................................................10
1.3.1 Handset hardware and software platforms.........................................................10
1.3.2 Horizontal and vertical integration of connectivity technologies ........................12
1.4 Single chip versus discrete chip integration .............................................................13
1.5 Handset value-chain overview...................................................................................15
1.5.1 Cellular chipset vendors......................................................................................15
1.5.2 Connectivity chipset vendors ..............................................................................16
1.5.3 Handset OS and software vendors .....................................................................16
1.5.4 Handset manufacturers.......................................................................................17
1.6 Drivers and barriers to integration.............................................................................17
1.6.1 Bluetooth .............................................................................................................17
1.6.2 WLAN...................................................................................................................18
1.6.3 UWB ....................................................................................................................18
1.6.4 NFC .....................................................................................................................19
2 Bluetooth in mobile phones...............................................................................................21 INDEX FUTURE HANDSET CONNECTIVITY TECHNOLOGIES
ii
STRATEGIC RESEARCH SERIES VAS RESEARCH SERIES
2.1 Overview of the Bluetooth technology ......................................................................21
2.1.1 Bluetooth specifications ......................................................................................22
2.1.2 Bluetooth applications and profiles.....................................................................23
2.2 Bluetooth and other connectivity technologies.........................................................25
2.2.1 Bluetooth and FM radio.......................................................................................26
2.2.2 Bluetooth and WLAN...........................................................................................26
2.2.3 Bluetooth and GPS..............................................................................................26
2.2.4 Bluetooth and cellular baseband integration......................................................26
2.3 Company profiles ......................................................................................................27
2.3.1 Broadcom............................................................................................................27
2.3.2 CSR .....................................................................................................................29
2.3.3 Infineon Technologies.........................................................................................31
2.3.4 Qualcomm...........................................................................................................32
3 Wireless LAN in mobile phones.........................................................................................35
3.1 Overview of Wireless LAN..........................................................................................35
3.1.1 WLAN standards .................................................................................................36
3.1.2 WLAN in mobile phones......................................................................................38
3.2 WLAN and Bluetooth coexistence.............................................................................39
3.3 Company profiles ......................................................................................................41
3.3.1 Atheros Communications....................................................................................41
3.3.2 Marvell .................................................................................................................43
3.3.3 Nanoradio............................................................................................................44
3.3.4 Redpine Signals ..................................................................................................44
3.3.5 STMicroelectronics and NXP wireless joint venture............................................44
3.3.6 Texas Instruments ...............................................................................................47
4 NFC and UWB technologies..............................................................................................51
4.1 Overview of NFC and UWB technologies..................................................................51
4.2 Near Field Communication technology and standards ............................................52
4.2.1 NFC modes .........................................................................................................54
4.2.2 NFC solution architecture and chipsets..............................................................54
4.3 Ultra wideband technology and standards ...............................................................55
4.3.1 WiMedia Alliance .................................................................................................56 FUTURE HANDSET CONNECTIVITY TECHNOLOGIES INDEX
iii
STRATEGIC RESEARCH SERIES VAS RESEARCH SERIES
4.3.2 Certified Wireless USB ........................................................................................57
4.4 Company profiles ......................................................................................................58
4.4.1 Alereon ................................................................................................................58
4.4.2 Artimi ...................................................................................................................59
4.4.3 Gemalto...............................................................................................................59
4.4.4 Innovision ............................................................................................................60
4.4.5 Inside Contactless...............................................................................................60
4.4.6 NXP Semiconductors ..........................................................................................61
4.4.7 Realtek.................................................................................................................62
4.4.8 Sony ....................................................................................................................62
4.4.9 Staccato Communications ..................................................................................63
4.4.10 Wisair...................................................................................................................63
4.4.11 WiQuest Communications ..................................................................................64
5 Handset manufacturers .....................................................................................................65
5.1 Nokia..........................................................................................................................66
5.2 Samsung Electronics.................................................................................................68
5.3 Motorola.....................................................................................................................70
5.4 Sony Ericsson............................................................................................................72
5.5 LG Electronics ...........................................................................................................74
5.6 Research In Motion....................................................................................................75
5.7 HTC............................................................................................................................77
5.8 Second tier handset vendors ....................................................................................79
5.8.1 Acer/E-TEN..........................................................................................................80
5.8.2 Apple ...................................................................................................................80
5.8.3 ASUSTeK.............................................................................................................81
5.8.4 BenQ ...................................................................................................................81
5.8.5 Fujitsu..................................................................................................................82
5.8.6 Gigabyte..............................................................................................................82
5.8.7 Hewlett Packard ..................................................................................................83
5.8.8 i-mate...................................................................................................................83
5.8.9 Mio Technology...................................................................................................84
5.8.10 NEC.....................................................................................................................84 INDEX FUTURE HANDSET CONNECTIVITY TECHNOLOGIES
iv
STRATEGIC RESEARCH SERIES VAS RESEARCH SERIES
5.8.11 Palm.....................................................................................................................85
5.8.12 Panasonic............................................................................................................85
5.8.13 Sagem.................................................................................................................86
5.8.14 Sharp...................................................................................................................86
5.8.15 Toshiba................................................................................................................86
6 Market trends and forecasts ..............................................................................................89
6.1 Market trends.............................................................................................................89
6.2 Worldwide handset sales ..........................................................................................91
6.3 Handset shipments by connectivity standard ...........................................................92
6.4 IC vendor market shares ...........................................................................................94
6.5 Connectivity IC shipment forecasts...........................................................................95
6.6 Connectivity IC revenue forecasts.............................................................................97
Glossary ..................................................................................................................................101
FUTURE HANDSET CONNECTIVITY TECHNOLOGIES INDEX
v
STRATEGIC RESEARCH SERIES VAS RESEARCH SERIES
Index
List of Figures
Figure 1.1: Range versus throughput for wireless communication technologies......................4
Figure 1.2: Performance comparison .........................................................................................7
Figure 1.3: Mobile phone hardware and software platform......................................................10
Figure 1.4: GPS handset and service value chain....................................................................15
Figure 2.1: Examples of Bluetooth profiles...............................................................................24
Figure 2.2: Overview of key Bluetooth chipset developers for handsets .................................27
Figure 2.3: Examples of Broadcom connectivity chipsets .......................................................28
Figure 2.4: Examples of CSR connectivity chipsets .................................................................30
Figure 2.5: Examples of Infineon connectivity chipsets ...........................................................32
Figure 2.6: Examples of Qualcomm GSM/EGPRS/HSDPA wireless chipsets .........................33
Figure 3.1: IEEE 802.11 WLAN standards ................................................................................36
Figure 3.2: Overview of mobile WLAN chipset developers ......................................................41
Figure 3.3: Examples of Atheros Communications’ connectivity chipsets...............................42
Figure 3.4: Examples of STMicroelectronics’ connectivity chipsets ........................................45
Figure 3.5: Examples of Texas Instruments connectivity chipsets...........................................48
Figure 4.1: UWB spectrum and band groups...........................................................................56
Figure 5.1: Tier 1 mobile phone and smartphone manufacturers (World 2007) ......................65
Figure 5.2: Nokia handset sales and market share.................................................................66
Figure 5.3: Nokia WLAN, GPS or NFC-enabled GSM/WCDMA handsets...............................67
Figure 5.4: Samsung handset sales and market share............................................................68
Figure 5.5: Samsung WLAN enabled handsets.......................................................................69
Figure 5.6: Motorola handset sales and market share.............................................................70
Figure 5.7: Motorola handsets with WLAN or GPS..................................................................71
Figure 5.8: Sony Ericsson handset sales and market share....................................................72
Figure 5.9: LG handset sales and market share.......................................................................74
Figure 5.10: RIM handset sales and market share...................................................................75
Figure 5.11: RIM BlackBerry smartphones..............................................................................76
Figure 5.12: GPS and WLAN-enabled HTC handsets .............................................................78 INDEX FUTURE HANDSET CONNECTIVITY TECHNOLOGIES
vi
STRATEGIC RESEARCH SERIES VAS RESEARCH SERIES
Figure 6.1: Worldwide handset sales by technology (World 2006–2012) ................................91
Figure 6.2: Number of handset models available by connectivity technology ........................93
Figure 6.3: Handset shipments by connectivity technology (World 2004–2007).....................93
Figure 6.4: Market shares, Bluetooth ICs for mobile phones (2007)........................................94
Figure 6.5: Market shares, WLAN ICs for mobile phones (2007) .............................................94
Figure 6.6: Handset sales by connectivity technology and attach rates (World 2007–12) ......95
Figure 6.7: Connectivity solution revenues by technology (World 2007–2012) .......................97