发布时间：2008

摘要

This report investigates the technology trends, applications, and market developments of GaAs ICs. U.S., Japanese, and European applications such as telecom, computers, defense, consumers, are reviewed. This report will provide the reader with an in-depth understanding of the technological and market factors determining the evolution of GaAs ICs.

目录及图表

Chapter 1   Introduction  1-1
    
Chapter 2   Executive Summary  2-1
    
2.1  Summary of Major Issues  2-1
2.2  Summary of Market Forecast    2-7
    
Chapter 3   Technology Issues  3-1
    
3.1  GaAs Devices   3-1
3.1.1  FETs    3-1
3.1.2  HEMTs   3-3
3.1.3   HBT 3-6
3.2   Comparison of Logic Structures     3-10
3.2.1   Buffered FET Logic     3-12
3.2.2   FET Logic    3-12
3.2.3   Capacitively Enhanced Logic 3-15
3.2.4   Direct-Coupled FET Logic    3-15
3.2.5   Source-Coupled FET Logic    3-17
3.3  Material Issues     3-20
3.3.1  Wafer Production     3-20
3.3.2  Etch Pit Densities     3-26
3.4  Equipment 3-27
3.4.1   Implanters   3-35
3.4.2   Lithography  3-35
3.4.3   Etching 3-36
3.4.4   Deposition   3-38
3.4.5 Rapid Thermal Processing 3-38
3.5  Packaging 3-39
3.5.1   Package Types     3-39
3.5.2   Bonding 3-42
3.6  Testing   3-46
3.7   Design    3-48
    
Chapter 4   Applications for GaAs ICs 4-1
    
4.1 Introduction 4-1
4.1.1 The Trend Toward Higher Frequencies 4-4
4.1.2 Transition from Analog to Digital Modulation 4-5
4.1.3 Discrete Components and Silicon-Based ICs 4-6
4.2 Markets 4-8
4.2.1 Telecommunications Systems 4-8
4.2.2 Wireless Communications Market 4-10
4.2.3 Television Systems 4-14
4.2.4 Computing 4-15
4.2.5 Data Communications 4-16
4.2.6 Automated Test Equipment 4-18
    
Chapter 5   IC Supplier and End-User Issues 5-1
    
5.1   Introduction   5-1
5.2  Competing Against Silicon 5-3
5.3  Competing Against The Japanese     5-13
5.4 Taiwan’s Market Momentum 5-14
5.5 Korea’s Market Momentum 5-20
5.6 Wafer Sizes 5-30
5.7 Competing Against SiGe 5-34
5.7.1 Introduction 5-34
5.7.2 Technology 5-39
5.7.2.1   Strained Silicon 5-40
5.7.2.2   Device Manufacturing 5-43
5.7.3 Applications 5-49
5.7.3.1   OC-192 5-50
5.7.3.2   OC-768 5-52
5.7.3.3   Bluetooth 5-53
5.7.3.4   Other SiGe Actvities 5-54
    
Chapter 6   Market Forecast 6-1
    
6.1  Driving Forces 6-1
6.2  Market Forecast Assumptions   6-5  
6.3   GaAs IC Market Forecast 6-6
6.4   SiGe IC Market Forecast 6-15
6.4 End Application Market 6-17
    
Chapter 7 Profile of GaAs IC Manufacturers  7-1
    
  LIST OF FIGURES 
    
3.1 Schematic of GaAs MESFET    3-2
3.2 Schematic of GaAs HEMT Device    3-4
3.3 Schematic of GaAs HBT Device    3-8
3.4 Schematic of GaAs HBT Device    3-9
3.5 Symbolic Representations of Various GaAs Transistor Type 3-11
3.6 Schematic of BFL Logic Gate 3-13
3.7 Schematic of FETL Logic Gate     3-14
3.8 Schematic of CEL Logic Gate 3-16
3.9 Schematic of DCFL Logic Gate     3-18
3.10 Schematic of SCFL Logic Gate     3-19
3.11 GaAs on Si Structure   3-23
3.12 GaAs on Si Structure   3-25
3.13 pHEMT MMIC Process Flow Chart 3-29
5.1 Comparison of Die Costs of Si and GaAs 5-4
5.2 Strained Silicon on Silicon Germanium 5-42
6.1 Worldwide Merchant GaAs IC Market Forecast By Device Type 6-8
6.2 Worldwide GaAs Merchant Market Forecast By Geographical Region 6-11
6.3 Worldwide GaAs Merchant Market Forecast By Application    6-13
6.4 Worldwide SiGe Market Forecast 6-16
    
  LIST OF TABLES 
    
5.1 Cost Comparison for GaAs Structures 5-6
6.1 Worldwide Merchant GaAs IC Market Forecast By Device Type 6-7
6.2 Worldwide Merchant Market Forecast By Geographical Region 6-10
6.3 Worldwide Merchant Market Forecast By Application    6-12
6.4 Market Shares of U.S. Merchant Participants 6-14