发布时间：2008

摘要

This report discusses the technology trends, products, applications, and suppliers of materials and equipment. It also gives insights to suppliers for future user needs and should assist them in long range planning, new product development and product improvement. A market forecast for Thin Film Deposition Tools is presented to 2006.

目录及图表

Chapter 1   Introduction   1-1
    
Chapter 2   Executive Summary 2-1
    
Chapter 3  Physical Vapor Deposition 3-1
    
3.1 Introduction 3-1
3.2 Sputtering Technology 3-2
3.3 Plasma Technology 3-5
3.4 Reactor Designs 3-14
3.4.1 Long-Throw Deposition 3-14
3.4.2 Collimated Sputter Deposition 3-16
3.4.3 Showerhead Deposition 3-18
3.4.4 Ionized PVD 3-22
3.5 Semiconductor Processing 3-28
3.5.1 Feature Patterning 3-28
3.5.2 Gap Fill 3-31
3.6 Targets 3-34
    
Chapter 4  Chemical Vapor Deposition 4-1
    
4.1 Introduction 4-1
4.2 Chemical Vapor Deposition (CVD) Techniques 4-1
4.2.1 APCVD 4-1
4.2.2 LPCVD 4-5
4.2.3 PECVD 4-8
4.2.4 HDPCVD 4-13
4.2.5 ALD 4-19
    
Chapter 5   Electrochemical Deposition 5-1
    
5.1 Introduction 5-1
5.2 Reactor Design 5-5
5.3 Challenges 5-6
5.4 Additives 5-8
5.5 Processing 5-9
5.5.1 Superfilling 5-9
5.5.2 Aspect Ratios 5-9
5.6 Copper Cathodes 5-10
    
Chapter 6   Film Deposition And Film Properties 6-1
    
6.1 Introduction 6-1
6.2 Dielectric Deposition 6-4
6.2.1 Silicon Dioxide 6-5
6.2.1.1   Thermal CVD 6-5
6.2.1.2   PECVD 6-6
6.2.1.3   HDPCVD 6-9
6.2.2 Silicon Nitride 6-13
6.2.2.1   Thermal CVD 6-13
6.2.2.2   PECVD 6-14
6.2.2.3   HDPCVD 6-19
6.2.3 Other Oxides 6-19
6.2.4 Low-K Dielectrics 6-20
6.3 Metal Deposition 6-21
6.3.1 Aluminum 6-21
6.3.2 Tungsten/Tungsten Silicide 6-24
6.3.3 Titanium Nitride 6-26
    
Chapter 7   Vendor Issues 7-1
    
7.1 Introduction 7-1
7.2 300mm Processing 7-6
7.3 Integrated Processing 7-9
7.4 Copper 7-13
7.5 Metrology 7-16
7.6 ESD 7-19
7.7 Parametric Test 7-20
    
Chapter 8   Market Forecast 8-1
    
8.1 Introduction 8-1
8.2 Key Issues 8-4
8.3 Market Forecast Assumptions 8-6
8.4 Market Forecast 8-8
8.4.1 Chemical Vapor Deposition 8-8
8.4.2 Physical Vapor Deposition 8-24
8.4.3 Copper Electroplating Market 8-28
8.4.4 Atomic Layer Deposition Market 8-31
    
  LIST OF FIGURES 
    
3.1 Schematic Of Sputtering System 3-3
3.2 Magnetron Sputtering Design 3-9
3.3 Showerhead Reactor Design 3-19
3.4 Ionized PVD 3-24
4.1 APCVD Reactor 4-3
4.2 Tube CVD Reactor 4-7
4.3 HDPCVD Reactor 4-17
5.1 Copper Electroplating System 5-3
8.1 Worldwide MCVD Market Shares 8-12
8.2 Worldwide DCVD Market Shares 8-13
8.3 Worldwide DCVD Market By Sectors 8-15
8.4 Worldwide HDHCVD Market Shares 8-17
8.5 Worldwide PECVD Market Shares 8-19
8.6 Worldwide SACVD Market Shares 8-21
8.7 Worldwide LPCVD Market Shares 8-23
8.8 Worldwide PVD Market Shares 8-27
8.9 Worldwide ECD Market Shares 8-30
8.10 ALD Applications a Share of Market 8-35
8.11 Worldwide ALD Market Shares 8-36
    
  LIST OF TABLES 
    
8.1 Worldwide CVD Market Forecast 8-9
8.2 Worldwide MCVD Market Shares 8-10
8.3 Worldwide DCVD Market Shares 8-11
8.4 Worldwide HDPCVD Market Shares 8-16
8.5 Worldwide PECVD Market Shares 8-18
8.6 Worldwide SACVD Market Shares 8-20
8.7 Worldwide LPCVD Market Shares 8-22
8.8 Worldwide PVD Market Forecast 8-25
8.9 Worldwide PVD Market Shares 8-26
8.10 Worldwide ECD Market Forecast 8-29
8.11 Worldwide ALD Market Forecast 8-34