发布时间：2008
摘要
This report examines and projects the technologies involved, their likely developments, what problems and choices are facing users, and where the opportunities and pitfalls are. The worldwide markets are analyzed and projected.
目录及图表
Chapter 1 Introduction 1-1
1.1 The Need For This Report 1-1
Chapter 2 Executive Summary 2-1
2.1 Summary of Major Issues 2-1
2.2 Summary of Market Opportunities 2-4
Chapter 3 Lithography Issues And Trends 3-1
3.1 Optical Systems 3-1
3.1.1 Scanning Projection Aligners 3-5
3.1.2 Step-and-Repeat Aligners 3-14
3.1.3 248nm DUV Resist 3-31
3.1.4 193nm DUV Resist 3-33
3.1.5 Mix-and-Match 3-36
3.1.6 157nm DUV And Resist 3-37
3.1.7 EUV 3-42
3.2 X-Ray Systems 3-46
3.2.1 X-Ray Sources 3-46
3.2.2 X-Ray Masks 3-51
3.2.3 X-Ray Steppers 3-53
3.2.4 X-Ray Resists 3-54
3.3 Electron Beam Systems 3-55
3.4 Ion Beam Systems 3-62
3.4.1 Direct Write 3-62
3.4.2 Ion Channel Masking 3-63
3.4.3 Ion Projection 3-63
3.5 New Technologies 3-65
3.5.1 Mulith Reference Distribution Aerial Image Formation 3-65
3.5.2 Holograms 3-71
3.5.3 X-Ray Laser 3-71
3.5.4 Atom Lithography 3-71
3.5.5 Microlenses 3-75
3.5.6 Nano-Imprint Lithography 3-80
3.6 Evaluation of Lithography Cost of Ownership 3-83
3.6.1 Introduction 3-83
3.6.2 Cost of Ownership Model 3-83
3.6.3 Results of Cost of Ownership Calculation 3-86
3.6.4 Individual Cost Estimation 3-93
o Lithography System Cost 3-93
o Process Costs 3-98
o Mask Costs 3-99
3.6.5 Conclusion 3-104
3.7 Lithography System Pros and Cons 3-106
Chapter 4 User - Supplier Strategies 4-1
4.1 Determining Lithography Needs 4-1
4.2 Benchmarking a Vendor 4-3
4.2.1 Pricing 4-3
4.2.2 Vendor Commitment and Attitudes 4-5
4.2.3 Vendor Capabilities 4-7
4.2.4 System Capabilities 4-9
4.2.5 Vendor Feedback During Equipment Evaluation 4-9
4.2.6 Vendor Feedback During Device Production 4-11
4.3 Competitive Environment 4-12
4.4 Equipment For Class 1 Cleanrooms 4-15
4.5 Equipment For the Factory of the Future 4-18
4.6 Opportunities 4-19
Chapter 5 Market Forecast 5-1
5.1 Driving Forces 5-1
5.1.1 Technical Trends 5-3
5.1.2 Economic Trends 5-8
5.1.3 Optical Limitations 5-12
5.2 Market Forecast Assumptions 5-13
5.3 Market Forecast 5-14
LIST OF FIGURES
1.1 Lithographic Equipment Requirements for DRAMs 1-2
3.1 Lithography Roadmap 3-6
3.2 Lens Arrangement For Submicron Features 3-18
3.3 EUV Lithography 3-43
3.4 Illustration of X-Ray Lithography 3-49
3.5 Schematic Of Scalpel Electron Beam System 3-56
3.6 Multi-Source E-Beam Lithography 3-58
3.7 Principles of LEEPL 3-61
3.8 Ion Projection Lithography System 3-64
3.9 Mulith Reference Distribution Aerial Image Formation 3-70
3.10 Schematic of Microlens 3-76
3.11 Mapper Mask-Based Lithography 3-78
3.12 Mapper Maskless Lithography 3-79
3.13 Nanoimprint Lithography Process 3-81
3.14 Nanoimprint Lithography Process 3-82
3.15 CoO Value in DRAM Mass Production 3-88
3.16 Lithography Costs for 40,000 Wafers/Mask 3-90
3.17 Lithography Costs for 1,000 Wafers/Mask 3-91
4.1 Manufacturing Costs Per Exposure Station 4-2
5.1 Lithography Market Vs Equipment Market 5-16
5.2 Lithography Requirements 5-19
5.3 Segmentation of Stepper/Scan Shipments 5-23
5.4 Market Shares of Vendors (Units) 5-24
5.5 Market Shares of Vendors 5-27
5.6 Market Shares of Vendors (Revenues) 5-28
LIST OF TABLES
3.1 Lithography Requirements for IC Production 3-16
3.2 Advanced Optical Lithography Scenarios 3-27
3.3 Lithography Requirements 3-29
3.4 Characteristics of X-Ray Systems 3-47
3.5 Basic Conditions of CoO Model 3-85
3.6 Calculation List of Lithography System Cost 3-95
3.7 Throughput Estimation of X-Ray Lithography 3-97
3.8 Cost of Reticle/X-Ray Mask 3-101
3.9 Phase Shift Mask and X-Ray Mask Manufacturing 3-103
4.1 Manufacturing Costs Per Exposure Station 4-2
5.1 Worldwide Capital Spending 5-9
5.2 DRAM Lithographic Requirements 5-11
5.3 Worldwide Stepper Market 5-21
5.4 Worldwide Stepper Market Shares 5-26