摘要
This report addresses the strategic issues impacting the mask making, inspection, and repair sectors of the semiconductor industry in the U.S. and the world. The mask making and equipment markets are analyzed and projected.
报告研究了全球半导体行业掩膜制造,检测及维修市场,并具体分析了各个市场的战略发展。报告不仅分析了掩膜制造市场,还介绍了掩膜生产及检修设备市场。
目录及图表
Chapter 1 Introduction 1-1
1.1 The Need For This Report 1-1
Chapter 2 Executive Summary 2-1
2.1 Summary of Major Issues 2-1
2.2 Summary of Market Opportunities 2-3
Chapter 3 Technology Issues 3-1
3.1 Mask Making 3-1
3.1.1 Mask Blanks 3-1
3.1.2 Completed Masks 3-4
3.2 Mask Making Equipment 3-18
3.2.1 Electron Beam Systems 3-18
3.2.2 Laser Pattern Generators 3-24
3.3 Mask Inspection 3-30
3.3.1 Mask Defects 3-33
o Transmission Variations 3-33
o Transparent Defects 3-34
o Nuisance Defects 3-34
o CD Variations 3-34
o Reflectivity Variations 3-35
3.4 Mask Repair 3-36
3.4.1 Laser Repair 3-37
3.4.2 Focused Ion Beam Repair 3-38
Chapter 4 User - Vendor Strategies 4-1
4.1 Establishing User Needs 4-1
4.1.1 Mask Making - Merchant or Captive 4-1
4.1.2 Submicron Mask Making Equipment - Laser vs E-Beam 4-5
4.1.3 Mask Inspection Equipment 4-11
4.1.4 Mask Repair - Laser vs FIB 4-12
4.1.5 Phase-Shift Masks 4-17
4.1.6 Optical Proximity Correction 4-28
4.1.7 NGL Technology Challenges 4-30
4.1.7.1 X-Ray Masks 4-37
4.1.7.2 EPL Masks 4-45
4.1.7.3 EUVL Masks 4-46
4.2 Competitive Vendor Strategies 4-47
4.2.1 Photronics 4-47
4.2.2 DuPont Photomask 4-53
4.2.3 Vendor Opportunities 4-65
Chapter 5 Market Forecast 5-1
5.1 Driving Forces 5-1
5.1.1 Introduction 5-1
5.1.2 Trends in IC Processing Technology 5-5
5.1.3 Mask and Reticle Requirements 5-9
5.1.4 Fast Turnaround Devices 5-9
5.1.5 Impact of Direct Write E-Beam and X-Ray 5-17
5.2 Market Forecast Assumptions 5-18
5.3 Mask Making, Inspection, and Repair 5-19
5.3.1 Completed Mask Market 5-19
5.3.2 Reticle/Mask Manufacturing Equipment 5-37
LIST OF FIGURES
3.1 Light Transmittance of Glasses 3-2
3.2 Photomask Fabrication Flow 3-6
3.3 Optical Photomask Fabrication Flow 3-7
3.4 SCAPLEL Photomask Fabrication Flow 3-8
3.5 MaskRigger Software in a Mask Fabrication Process 3-21
3.6 Schematic of a Laser Pattern Generator 3-25
3.7 Mulith Reference Distribution Aerial Image Formation 3-29
3.8 Die-to-Die and Die-to-Database Inspection 3-31
3.8 Schematic of a Focused Ion Beam System 3-39
3.9 Illustration of Clear and Opaque Mask Repair 3-41
4.1 Throughput of Alta 3000 Laser Versus Alta 3000 HT Systems 4-7
4.2 Subwavelength Gap 4-19
4.3 Phase-Shifting Masks 4-22
4.4 iN Phase Mask Design 4-25
4.5 Illustration of OPC 4-29
4.6 Main NGL Mask Formats 4-32
4.7 Mask Costs Versus Feature Size 4-42
5.1 Production Costs for Maskmaking 5-11
5.2 Capital Expenditures and Revenues 5-12
5.3 Photomask Functionality 5-13
5.4 North American Merchant Mask Making Market Shares 5-22
5.5 European Merchant Mask Making Market Shares 5-27
5.6 Worldwide Merchant Mask Making Market Shares 5-28
5.7 Pacific Rim Merchant Mask Making Market Shares 5-29
5.8 Japan Merchant Mask Making Market Shares 5-30
5.9 Worldwide Mask Making Equipment Market Shares 5-41
LIST OF TABLES
4.1 FIB and Laser Repair Comparison 4-14
4.2 Advanced Optical Lithographic Scenarios 4-21
4.3 NGL Mask Formats 4-33
4.4 Cost of Reticle/X-Ray Mask 4-41
4.5 Phase Shift Mask and X-Ray Mask Manufacturing 4-44
4.6 Photronics Photomask Facilities 4-49
4.7 DuPont Photomask Facilities 4-57
5.1 Overall Roadmap of Technology Characteristics 5-6
5.2 Roadmap of Mask Inspection 5-7
5.3 DRAM Lithographic Requirements 5-8
5.4 Specifications for 5:1 and 1:1 Reticles for DRAMs 5-10
5.5 North American Mask Making Market 5-20
5.6 European Mask Making Market 5-23
5.7 Worldwide Mask Making Market by Feature Size 5-25
5.8 Captive Mask Shops 5-32
5.9 Mask Consumption by U.S. Semiconductor Companies 5-33
5.10 Mask Consumption by European Semiconductor Companies 5-34
5.11 Mask Consumption by Asian Semiconductor Companies 5-35
5.12 Worldwide Mask Making Equipment Market Forecast 5-39
5.13 Worldwide Mask Making Equipment Market Shares 5-40
5.14 Mask Inspection Economics 5-45