发布日期：2007年10月

摘        要：
Abstract:

Cost-effective burn-in-with-test is essential to produce high reliability components. To ensure uniform burn-in of all components, a test solution must control the temperature, voltage, power, test sequence, and inputs/outputs to the DUT. Of these, temperature becomes significantly harder to control as the power level of the devices increases.

When burning in relatively low-power components, pressing a heat sink against the components and blowing air over the devices in a temperature-controlled chamber may be effective. As the power of semiconductor devices rises, individual temperature control becomes very important to ensure that all devices are uniformly stressed.

[FIGURE 1 OMITTED]

Power consumed by high-power devices can vary by 40% or more due to variations in the fabrication process and different operation modes of the device. The thermal interface between the DUT and any cooling sink can vary significantly, and the airflow in a burn-in system can fluctuate by 30% or more.

All of these variables can lead to large temperature variations among the same device types in a single burn-in system. Some components may be damaged while others are inadequately burned in.

Figure 1 is a thermal schematic representing the flow ...

正文目录：
Article Information:

Published in: EE-Evaluation Engineering
Issue Number: 10
Volume Number: 46
Date Published: 01 October 2007
Language: English
Word Count: 2440

Author(s) of this article include:
McElreath, John T.